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Thermal Interface Materials new potential applying fields---Smart Phone
- Categories:Events
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- Time of issue:2015-12-14 00:00
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(Summary description)Thermal Interface Materials for Smart Phone
Thermal Interface Materials new potential applying fields---Smart Phone
(Summary description)Thermal Interface Materials for Smart Phone
- Categories:Events
- Author:
- Origin:
- Time of issue:2015-12-14 00:00
- Views:
Globe launch of LG G3 was last June, and there are many people struggling with heating issue on this smart phone, it work
with chipset Qualcomm Snapdragon 801 and CPU Quad-core 2.5 GHz, Qualcomm Snapdragon 801 is the chipset for
middle&high-end smart phone, heat dissipation performance of this chipset is not very good, and because of the heat
dissipation designing of the phone not very good at the same time, LG G3 working temperature is high,and as we all know
that high temperature is not good for CPU as well as the system operation,the phone will crash or close directly. And if
CPU working with a lower temperature will prolong the life time of the cell phone.
There is a good solution for the over working temperature of the smart phones’ CPU chipset--we can use thermal
interface material, we can use the thermal paste on the CPU,just like the computer. There are two materials good for this
situation,thermal paste&thermal pad
1.thermal paste,it is good for the heat transfer, and very easy to apply on the different sizes of the chipset with the scraper,
but please do not use too much thermal paste, best thickness is 0.15~0.2mm
2.thermal pad,it is easier to applying&moving than thermal paste,but the thickness and size not easy to control, if more
thicker than the gaps you want to fill, you can’t cover the pone’s back case back
Using thermal interface materials on the smart phone is a trend,because chipsets of the smart phone with higher GHz and
more heat, thermal interface materials will help smart phone with more smooth system performance and longer lift time.
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