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The basic principle of phase change materials

The basic principle of phase change materials

  • Categories:Events
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  • Time of issue:2014-09-30 00:00
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(Summary description)A phase change material (PCM - Phase Change Material) refers to changes in temperature and changes in the form of latent heat material can provide。

The basic principle of phase change materials

(Summary description)A phase change material (PCM - Phase Change Material) refers to changes in temperature and changes in the form of latent heat material can provide。

  • Categories:Events
  • Author:
  • Origin:
  • Time of issue:2014-09-30 00:00
  • Views:
Information

A phase change material (PCM - Phase Change Material) refers to changes in temperature and changes in the form of latent heat material can provide。

Process occurs in the solid material, liquid and gaseous state is called a phase change transition. Phase change material in the process, will be exothermic or endothermic, while the object will remain constant temperature. And this feature to bring the gospel to our thermal control

Thermal Phase Change Material (PC) is a heat-reinforced polymer, is designed to make the heat resistance and the power consumption of electronic devices connected thereto between the fins is reduced to a minimum, the thermal performance of the small channels allow the fins best, and improved microprocessor, memory module DC / DC converter and the reliability of the power module

The key properties of thermal phase change material is a phase transition characteristics: material is a solid at room temperature and easy to handle, it may be as clean and dry pad firmly, or heat sink for a surface of the device. When the device reaches operating temperature, phase change materials softened, add a little clamping force, the same material as the thermal grease and easily integrate the two mating surfaces. This gap between the heat sink and the device with the ability to completely fill the void interface makes phase-change pad is superior to non-current elastomer or graphite-based thermal pads, and get similar performance thermal grease.

A phase change material is thermally conductive, but because the material is subjected to a heat sink installed in the conventional phase change, it is possible to metal contact with the metal, the phase change material can be used as an electrical insulating .. Small thermal interface pad not disguise the structure paste mixture, heat sink can not be directly connected to the device, you must use clamps or other mechanical fasteners to maintain the clamping pressure of the heat sink to the device。

The characteristics of the phase transition temperature

1.It belongs to the absorption-type passive temperature control, cooling and conventional type are very different. It does not rely on the temperature difference between the heat, is not affected by changes in ambient temperature, the element or device has stabilized at the desired temperature. Especially in the high power density and requires low equilibrium temperature, conventional heat can not solve the problem, and the use of phase transition temperature can be solved. Under low pressure or vacuum conditions require cooling equipment using this technology better temperature control

2.Compare with active temperature control, it is no electricity, no moving parts, can be used for vibration, shock, acceleration and other harsh mechanical conditions of work, high reliability

3.Under certain conditions, it can replace the water-cooled and air-cooled heat dissipation, such as the temperature of the hot end of the semiconductor refrigeration device, not water-cooled or air-cooled, water saving, with great economic value.

4.It (such as a 40 ℃) work at low temperatures, it is stored energy, in order to make the device a great rate to return to normal operating temperature.
  
5.It cyclical work, long-term use。

6.Equilibrium at low temperatures, it is more than a radiator heat sink method is about 2.6 times the volume can be reduced; reduce the weight of about 4.5 times。

Phase change material characteristics and advantages of the program has been confirmed - the product used in the PC manufacturer has more than a few years; currently used more often, more reliable quality phase-change thermal materials for Honeywell / Honeywell, including Intel, Huawei, ZTE and other large manufacturers are using this phase-change thermal materials, superior performance. By Philips and other companies to test, Honeywell lower than other brands about 4 ℃, reliability has been confirmed - no loss or dried after 27,000 temperature cycles, providing customer touch-cut shape (cut on light volume) 52 ℃ or 58 ℃ phase transition temperature, a thixotropic (lake-like viscosity) at operating temperature to ensure the performance of the material will not be extended or dripping when used in the vertical direction, the non-conductive

Thermally conductive phase change material (PC) Typical Applications: Microprocessor Memory Modules DC / DC converter power module IGBT power semiconductor module solid state relay bridge rectifier cache memory chips。

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