How to choose the thermal conductive grease applied in intelligent security monitoring, in the use of intelligent security monitoring in the core chip temperature is too high, easy to cause problems such as error code, picture blur, picture quality reduction, shorten the service life, packet loss, etc., the use of thermal conductive grease can alleviate the general above, so that users are more assured to use
The problem of thermal failure is a problem that will occur in any kind of electronic equipment, and the solution is to have a targeted heat dissipation.
At present, the scope of use of security monitoring includes video surveillance, access control, anti-theft alarm three categories, generally used for more strict formal enterprises, the requirements for security monitoring are naturally higher, to solve the user's problem is to solve our own problems.
If your security monitoring is a reliable supplier of thermal grease in the world, Huaneng Zhiyan will be a good choice. We also have a price advantage. Why?
Because we are a manufacturer, direct sales, belongs to the asset from small, to undertake large orders, packaging as small as 0.5g to 10kg, can be customized according to your needs, packaging size, and specifications. Bulk customization is cheaper.
According to the needs of different electronic products, our thermal conductivity of thermal grease from 1.42W-13.4W/m-k thermal grease can be selected, support OEM customization, a wide range of application units.
We have studied the current camera gradually to 1080P, 4K, 8K image quality and other high-end high-definition pixels, high-definition image processing and big data computing and other advanced technologies make thermal management and EMI shielding problems become increasingly prominent.
Large power consumption and heat output and closed environment put higher requirements on the overall heat dissipation scheme. The molecular volatilization of thermal conductive materials and the precipitation of silicone oil, silicon migration phenomenon have an important impact on optical lenses. The low temperature resistance of the chip becomes the bottleneck of heat dissipation, and how to reduce the interface thermal resistance is an important factor to be considered in thermal design.
In order to ensure the stable and reliable operation of the camera, it is urgent to reduce the working heat load of the core components and alleviate the thermal stress concentration of the circuit board, you can choose our manual service.