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Thermal silica performance depends on factors?
Commonly used thermal silica having a high thermal conductivity, high tensile strength and low fluidity and other characteristics generally required for curing under heat, thermal conductivity, good adhesion properties. The different characteristics of different thermal silica, then factors that affect the performance of thermal silica, what does? - Data Center Cooling Management 2021-03-25
- How to Remove Heat from PCB 2021-01-22
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Dear customers:
New model thermal
grease HY-P13 , the
thermal conductivity
is 13.4w/m-k
Thank you .
Halnziye
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