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Thermal silica performance depends on factors?
Commonly used thermal silica having a high thermal conductivity, high tensile strength and low fluidity and other characteristics generally required for curing under heat, thermal conductivity, good adhesion properties. The different characteristics of different thermal silica, then factors that affect the performance of thermal silica, what does?
How to Remove Heat from PCB 2021-01-22
Choosing the Right Thermal Interface Material 2020-12-24

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Shenzhen Halnziye Electronics Co., Ltd. Since its establishment in 2007, Halnziye has been committed to providing thermal interface materials with best quality but competitive prices. Insisting on this commitment, we have provided optimum products for numerous famous brands ...

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    Dear customers: 
    New model thermal
    grease HY-P13 , the 
    thermal conductivity
    is 13.4w/m-k 

    Thank you .
                    Halnziye

+86-755-28772795

Add: 3-4/F Bld.D Hehengxing Sci&Tech Park,No.19 Minqing Road,Longhua

District,Shenzhen China

Fax:+86-755-28772796
Email:sales@halnziye.com